JEDEC規格一覧

IJEDEC規格一覧

このページでは、JEDEC規格一覧を掲載します。
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規格番号 規格対象
JESD22-A100C CYCLED TEMPERATURE HUMIDITY BIAS LIFE TEST:
JESD22-A101C STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST:
JESD22-A102-C ACCELERATED MOISTURE RESISTANCE - UNBIASED AUTOCLAVE:Status: Reaffirmed June 2008
JESD22-A103C HIGH TEMPERATURE STORAGE LIFE
JESD22-A104D TEMPERATURE CYCLING
JESD22-A105C POWER AND TEMPERATURE CYCLING:
JESD22-A106B THERMAL SHOCK:
JESD22-A107B SALT ATMOSPHERE:
JESD22-A108C TEMPERATURE, BIAS, AND OPERATING LIFE
JESD22-A109-A HERMETICITY:
JESD22-A110C HIGHLY ACCELERATED TEMPERATURE AND HUMIDITY STRESS TEST (HAST)
JESD22-A111 EVALUATION PROCEDURE FOR DETERMINING CAPABILITY TO BOTTOM SIDE BOARD ATTACH BY FULL BODY SOLDER IMMERSION OF SMALL SURFACE MOUNT SOLID STATE DEVICES:
JESD22-A112-A MOISTURE-INDUCED STRESS SENSITIVITY FOR PLASTIC SURFACE MOUNT DEVICES - SUPERSEDED BY J-STD-020A, April 1999.Status: Rescinded May 2000
JESD22-A113F PRECONDITIONING OF PLASTIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
JESD22-A114E 人体帯電モデル静電破壊試験
JESD22-A114F ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING HUMAN BODY MODEL (HBM):
JESD22-A115-A ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING MACHINE MODEL (MM): This is a valid test method, however it is not currently being used in the industry, the preferred industry test methods are JESD22A114 or JESD22C101.
JESD22-A117B ELECTRICALLY ERASABLE PROGRAMMABLE ROM (EEPROM) PROGRAM/ERASE ENDURANCE AND DATA RETENTION TEST:
JESD22-A118
  • ACCELERATED MOISTURE RESISTANCE - UNBIASED HAST:Status: Reaffirmed June 2008
JESD22-A119 LOW TEMPERATURE STORAGE LIFEStatus: Reaffirmed

September 2009

JESD22-A120A TEST METHOD FOR THE MEASUREMENT OF MOISTURE DIFFUSIVITY AND WATER SOLUBILITY IN ORGANIC MATERIALS USED IN INTEGRATED CIRCUITS:
JESD22-A121A MEASURING WHISKER GROWTH ON TIN AND TIN ALLOY SURFACE FINISHES
JESD22-A122 POWER CYCLING
JESD22-B100B PHYSICAL DIMENSION:Status: Reaffirmed June 2006
JESD22-B101B EXTERNAL VISUAL:
JESD22-B102E SOLDERABILITY
JESD22-B103B VIBRATION, VARIABLE FREQUENCY:Status: Reaffirmed June 2006
JESD22-B104C MECHANICAL SHOCK: - Typo found on pg.1 in title, a new version dated December 2004 has been posted. if you downloaded between 11/10/04 & 12/10/04, please download again
JESD22-B105C LEAD INTEGRITYStatus: Reaffirmed June 2006
JESD22-B106D RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICES:
JESD22-B107C MARKING PERMANENCY:
JESD22-B108A COPLANARITY TEST FOR SURFACE-MOUNT SEMICONDUCTOR DEVICES:
JESD22-B109A FLIP CHIP TENSILE PULL:
JESD22-B110A SUBASSEMBLY MECHANICAL SHOCKStatus: Reaffirmed June 2009
JESD22-B111 BOARD LEVEL DROP TEST METHOD OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS:
JESD22-B112A PACKAGE WARPAGE MEASUREMENT OF SURFACE-MOUNT INTEGRATED CIRCUITS AT ELEVATED TEMPERATURE
JESD22-B113 BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS
JESD22B114 MARK LEGIBILITY
JESD22-B115 SOLDER BALL PULL
JESD22-B116A WIRE BOND SHEAR TEST
JESD22-B117A SOLDER BALL SHEAR:
JESD22-C101C デバイス帯電モデル静電破壊試験
JESD22-C101E FIELD-INDUCED CHARGED-DEVICE MODEL TEST METHOD FOR ELECTROSTATIC DISCHARGE WITHSTAND THRESHOLDS OF MICROELECTRONIC COMPONENTS:
JESD78A ラッチアップ試験
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