The test is applicable for evaluation, screening, monitoring, and/or qualification of all solid state devices. High Temperature storage test is typically used to determine the effect of time and temperature, understorage conditions, for thermally activated failure mechanisms of solid state electronic devices, includingnonvolatile memory devices (data retention failure mechanisms). During the test elevated temperatures(accelerated test conditions) are used without electrical stress applied. This test may be destructive,depending on Time, Temperature and Packaging (if any).


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