This document describes a test method only; acceptance criteria and qualification requirement are not defined. This test method applies to solder ball pull force testing prior to end-us attachment. Solder balls are pulled individually using mechanical jaws; force and failure mod data are collected and analyzed. Other specialized solder ball pull methods using a heate thermode, gang pulling of multiple solder joints, etc., are outside the scope of this document both low and high speed testing are covered by this document.

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