JESD22-B102E規格とは

This test method provides optional conditions for preconditioning and soldering for the purpose of assessing the solderability of device package terminations.

It provides procedures for dip & look solderability testing of through hole, axial and surface mount devices and a surface mount process simulation test for surface mount packages.

The purpose of this test method is to provide a means of determining the solderability of device package terminations that are intended to be joined to another surface using lead (Pb) containing or Pb-free solder for the attachment.

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